EEE6214 Packaging and Reliability of Microsystems (15 credits)

Year Running: 2021/2022

Credit level: F7

Description

The module describes the methods used to fabricate microsystems. It also introduces and develops an understanding of the reliability and failure mechanisms in the devices and resulting microsystems.

Reading List

Please click here for reading list.

Teaching Methods

Delivery Type	Hours
Independent	112.0
Lecture	36.0

Methods of assessment

Assessment Type	Duration	% of formal assessment	Semester
Course Work	0.0	100 %
Exam	4.0	0 %

Teaching methods and assessment displayed on this page are indicative for 2021-22.